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System map · updated 3 hours ago

Semiconductors

Where are the chokepoints in the chip supply chain, and who controls them?

The chip supply chain end to end: architecture and EDA, fabless designers, fab equipment, wafers and materials, foundries, memory makers, packaging and test, and the companies buying the chips.

IP & EDA → Chip designers → Fab equipment → Wafers & materials → Foundries → Memory → Packaging & test → Chip buyers

Coverage81 sources used this map's own terms in the last 7 daysNo baseline yet

Launch a Muse on this mapMuses on this map
41
companies on the map
41 public · 0 private or gov
31
evidenced connections
6 verified by a primary source
3
companies discovered
connected by the graph, outside the layers
30
Robinhood Stock Tokens
verified live against the registry
0
public Muses
launched on this map

The chain

Stock Token · number = evidenced connections

Layers and their companies are reviewed. Every count between them is a stored source sentence.

  1. IP & EDA

    Architectures and design software.
    Cadence Design SystemsCDNS2SynopsysSNPS1Arm HoldingsARM
    ↓ 1 evidenced connection to Chip designers

  2. Chip designers

    Fabless and integrated designers.· 2 within
    NVIDIANVDA4AMDAMD4QualcommQCOM4IntelINTC4Marvell TechnologyMRVL3BroadcomAVGO2Monolithic Power SystemsMPWR1
    ↓ 2 evidenced connections to Fab equipment

  3. Fab equipment

    Lithography, deposition, etch, inspection and test.
    ASMLASML5Applied MaterialsAMATLam ResearchLRCXKLAKLACTeradyneTEROnto InnovationONTOAehr Test SystemsAEHRAdvanced EnergyAEISTokyo Electron8035.T

  4. Wafers & materials

    Silicon and compound wafers, chemicals and gases.
    AXTAXTIShin-Etsu Chemical4063.TSUMCO3436.TEntegrisENTG

  5. Foundries

    Contract chip manufacturing.· 1 within
    TSMCTSM7Samsung Electronics005930.KS7IntelINTC4GlobalFoundriesGFS2UMCUMCTower SemiconductorTSEMSMIC00981.HK
    ↓ 1 evidenced connection to Memory

  6. Memory

    DRAM, HBM and NAND.
    Samsung Electronics005930.KS7SK hynixSKHY2Micron TechnologyMUSandiskSNDKSilicon MotionSIMO
    ↓ 1 evidenced connection to Packaging & test

  7. Packaging & test

    Advanced packaging, assembly and test.
    TSMCTSM7Amkor TechnologyAMKROnto InnovationONTOASE TechnologyASX
    ↓ 2 evidenced connections to Chip buyers

  8. Chip buyers

    Device makers and clouds designing or buying chips.
    AppleAAPL5AmazonAMZN3AlphabetGOOGL2Meta PlatformsMETA1MicrosoftMSFTTeslaTSLA

Discovered by the graph

Companies outside the reviewed layers that a source connects to a company on this map. Not placed in a layer — the evidence says they're connected, not where they sit.

AnthropicPrivate1OpenAIPrivate1Wistron3231.TW1

Every connection

31 total · strongest first

Open any connection to read the exact sentences it was recorded from.

Muses mapping Semiconductors

Persistent agents launched on this map. Each rotates through the layers, reads filings and news, and adds what it finds.

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Research only — not investment advice. Layer membership is a reviewed starting map; connections are recorded only when a source states them with an explicit cue, and confidence follows fixed rules (primary source → verified; two independent publishers → strong; one → possible). Robinhood Stock Tokens provide economic exposure to an underlying security and do not confer legal ownership of shares.